| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0226-4 | CL21B334KBFNNNE | 6,093 | 0.63 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.33μF/50Vdc, ±10% X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0328-0205-4 | 0805B334K500CT | 172,328 | 1.12 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.33μF/50Vdc, ±10%, X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0082-0215-9 | CL31B104KBCNNNC | 67,373 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0237-9 | CL05B104KO5NNNC | 25,723 | 0.10 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0169-0139-5 | C1608C0G1H090C080AA | 1,554 | 2.33 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 9pF/50Vdc,±0.25pF C0G | 50V | 9pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | TDK | Surface Mount | - |
| 0306-0212-5 | C0603C680F5HACTU | 7,327 | 2.80 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 68pF/50Vdc, ±1%, X8R | 50V | 68pF | ±1% | X8R | 150°C | 0603 (1608) | KEMET | Surface Mount | - |
| 0151-0792-8 | CC0402KRX7R8BB682 | 9,800 | 0.10 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 6.8nF/25V, ±10%, X7R | 25V | 6.8nF | ±10% | X7R | 125°C | 0402 (1005) | YAGEO | Surface Mount | - |
| 0328-0218-3 | 0805N561J500CT | 8,997 | 0.45 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 560pF/50Vdc, ±5% NP0 (C0G) | 50V | 560pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0169-0123-2 | CGJ4C2C0G1H561J060AA | 1,725 | 1.92 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 560pF/50Vdc ±5%, C0G | 50V | 560pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | TDK | Surface Mount | - |
| 0169-0019-1 | C1608C0G1H470J | 0 | 0.31 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 47pF/50Vdc ±5%, C0G | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | TDK | Surface Mount | - |
| 1649-0006-1 | 0402CG470J500NT | 9,770 | 0.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 47pF/50V, ±5%, COG(NPO) | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0328-0135-1 | 0805B473K500CT | 8,868 | 0.37 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 47nF/50V ±10%, X7R General Purpose | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0328-0184-2 | 0603N471J500CT | 12,254 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±5% NP0 (C0G) | 50V | 470pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0149-6 | CL21B471KBANNNC | 13,107 | 0.39 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0190-9 | CL21B471KBANNNC-CT | 131 | 0.36 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
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