| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0160-0339-9 | RDER72E104K2K1H03B | 1,720 | 7.39 |  | PB-Free | RoHS | Radial Lead Ceramic Capacitor 0.1μF/250VDC ±10% X7R,Lead Spacing 5.0mm,Inside Crimp Lead for General Use | 250V | 0.1μF | ±10% | X7R | 125°C | RADIAL | MURATA | Through Hole | 5mm |
 | 0092-0068-4 | SR215C104KARAP4-90 | 6 | 4.75 | | PB-Free | RoHS | Radial Lead Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 85°C | RADIAL | KYOCERA AVX | Through Hole | 5.08mm |
| 0092-0214-2 | SR215E104MARTR1 | 0 | 1.12 | | PB-Free | RoHS | Radial Lead Cap 0.1μF/50V, ±20%,Z5U | 50V | 0.1μF | ±20% | Z5U | - | RADIAL | KYOCERA AVX | Through Hole | 5.08mm |
 | 0328-0046-3 | 0402B104K100CT | 35,910 | 0.13 | | PB-Free | RoHS | Multilayer Chip Capacitor MLCC 0.1μF/10Vdc, ±10% | 10V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
 | 0493-0012-9 | 201R14S5R6CV4T | 515 | 1.44 | | | | Multi-Layer Chip Cap 5.6pF/200Vdc, ±0.25pF, NPO Ultra-High Q | 200V | 5.6pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | JOHANSON | Surface Mount | - |
| 0493-0011-6 | 201R14S3R9BV4T | 2 | 1.87 | | | RoHS | Multi-Layer Chip Cap 3.9pF/200Vdc, ±0.1pF, NPO Ultra-High Q | 200V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | JOHANSON | Surface Mount | - |
| 0493-0005-4 | 201R14S0R3BV4T | 1,835 | 1.85 | | | RoHS | Multi-Layer Chip Cap 0.30pF/200Vdc, ±0.1pF, NPO Ultra-High Q | 200V | 0.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | JOHANSON | Surface Mount | - |
| 0493-0004-1 | 201R14S0R2AV4T | 876 | 1.41 | | | RoHS | Multi-Layer Chip Cap 0.20pF/200Vdc, ±0.05pF, NPO Ultra-High Q | 200V | 0.2pF | ±0.05pF | C0G (NP0) | 125°C | 0603 (1608) | JOHANSON | Surface Mount | - |
| 0328-0081-4 | 0402N4R7C500LT | 7,226 | 0.10 | | PB-Free | | Multilayer Ceramic Chip Cap,4.7pF/50Vdc,±0.25pF NP0 (C0G) | 50V | 4.7pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0263-1 | CL10C750JB8NNNC | 143,580 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 75pF/50Vdc, ±5%, COG | 50V | 75pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0328-0193-3 | 0805B682K500CT | 40,480 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 6.8nF/50Vdc, ±10%, X7R | 50V | 6.8nF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0082-0257-5 | CL31A476MPHNNNE | 7,486 | 2.04 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47μF/10Vdc, ±20%, X5R | 10V | 47μF | ±20% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0227-6 | CL21B473KBCNNNC | 12,930 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
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