| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0264-2 | CL05A225MQ5NSNC | 5,473 | 0.19 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/6.3Vdc, ±20%, X5R | 6.3V | 2.2μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0290-3 | CL10A225KL8NNNC | 3,750 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/35Vdc, ±10%, X5R | 35V | 2.2μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0246-1 | CL10B222KB8NFNC | 1,787 | 0.74 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2nF/50Vdc, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0165-2 | CL21B105KBFNNNE | 28,567 | 0.54 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0328-0192-1 | 0805N160J500CT | 19,358 | 0.52 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 16pF/50Vdc, ±5%, NP0 (C0G) | 50V | 16pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0082-0248-4 | CL10C151JB8NNNC | 14,630 | 0.75 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0262-8 | CL10C120JB8NNNC | 6,320 | 0.26 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 12pF/50Vdc, ±5%, COG | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0266-6 | CL05A106MQ5NUNC | 9,161 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/6.3Vdc, ±20%, X5R | 6.3V | 10μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0187-1 | CL31A106KBHNNNE | 107,909 | 1.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/50Vdc, ±10%, X5R | 50V | 10μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0243-4 | CL10A106MO8NQNC | 28,780 | 0.71 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0223-8 | CL10B103KB8NNNC | 119,664 | 0.14 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10% X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0285-1 | CL05B103KB5NNNC | 9,703 | 0.15 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0328-0222-4 | 0402N101J500LT | 9,700 | 0.06 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 100pF/50Vdc, ±5%, NP0 (C0G) | 50V | 100pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 0082-0150-3 | CL21B152KBANNNC | 11,053 | 0.18 | | PB-Free | | Multilayer Ceramic Chip Cap, 1.5nF/50Vdc, ±10%, X7R | 50V | 1.5nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0244-6 | CL05A474KA5NNNC | 8,354 | 1.08 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.47μF/25Vdc, ±10%, X5R | 25V | 0.47μF | ±10% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
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