| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0228-8 | CL21A475KBQNNNE | 54,406 | 0.78 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/50Vdc, ±10% X5R | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0265-4 | CL10A475KO8NNNC | 82,886 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0268-1 | CL05A475MP5NRNC | 3,780 | 0.29 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/10Vdc, ±20%, X5R | 10V | 4.7μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0261-6 | CL10C4R7BB8NNNC | 15,615 | 0.97 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7pF/50Vdc, ±0.1pF COG | 50V | 4.7pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0328-0211-9 | 0603N330J500CT | 22,941 | 0.20 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 33pF/50Vdc, ±5%, NP0 (C0G) | 50V | 33pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0205-6 | CL21B331KBANNNC | 81,691 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 330pF/50Vdc, ±10% X7R | 50V | 330pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0328-0204-2 | 0603N300J500CT | 41,400 | 0.24 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 30pF/50Vdc, ±5%, NP0 (C0G) | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0270-7 | CL10C3R9BB8NNNC | 28,268 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0256-3 | CL10C3R3BB8NNNC | 14,634 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0247-2 | CL10A226MQ8NRNC | 696 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0176-9 | CL21A226MAQNNNE | 980 | 0.90 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±20%, X5R | 25V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0260-4 | CL31A226KAHNNNE | 18,575 | 2.20 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±10%, X5R | 25V | 22μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0328-0225-1 | 0603N220F101CT | 7,480 | 1.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22pF/100Vdc, ±1%, NP0 (C0G) | 100V | 22pF | ±1% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0283-6 | CL10B223KB8NNNC | 3,074 | 0.53 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22nF/50Vdc, ±10%, X7R | 50V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0271-9 | CL10C2R7CB8NNNC | 11,101 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc,±0.25pF COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
My account
Cart
My wishlist
