| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0154-5 | CL10C300JB8NNNC | 0 | 0.10 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0210-9 | CL31C300JBCNNNC | 313 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0328-0216-9 | 0805B332K500CT | 39,763 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 3.3nF/50Vdc, ±10% X7R | 50V | 3.3nF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0306-0118-2 | C0603C332K5RACTU | 6,926 | 0.20 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 3.3nF/50Vdc, ±10%, X7R | 50V | 3.3nF | ±10% | X7R | 125°C | 0603 (1608) | KEMET | Surface Mount | - |
| 0328-0173-7 | 0603N270J500CT | 7,697 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 27pF/50Vdc,±5% NP0 (C0G),General Purpose | 50V | 27pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0328-0217-1 | 0805B271K500CT | 45,683 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 270pF/50Vdc, ±10% X7R | 50V | 270pF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0834-0004-7 | TS18000J226M4TX00R | 9,735 | 3.27 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0402 (1005) | SUNTAN | Surface Mount | - |
| 0082-0214-7 | CL32A226KAJNNNE | 50,625 | 6.31 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/25Vdc, ±10% X5R | 25V | 22μF | ±10% | X5R | 85°C | 1210 (3225) | SAMSUNG | Surface Mount | - |
| 0082-0163-6 | CL31A226KPHNNNE | 21,382 | 1.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10Vdc,±10%, X5R | 10V | 22μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
 | 0033-0021-6 | LMK212BJ226MG-T | 23,044 | 0.83 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10V, ±20%, X5R, High Dielectric Type | 10V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |
| 0328-0163-4 | 0603N220J500CT | 195,550 | 0.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% NP0 (C0G), General Purpose | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0200-6 | CL10C220JB8NNNC | 4,287 | 0.32 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% COG | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0151-0384-5 | CC0805JRNPO9BN220 | 26,638 | 0.36 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50V, ±5%, NPO | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | YAGEO | Surface Mount | - |
| 0328-0125-7 | 0603B223K500CT | 4,907 | 0.25 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22nF/50Vdc,±10%,X7R | 50V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 1649-0010-2 | 0402B223K500NT | 9,942 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22nF/50V, ±10%, X7R | 50V | 22nF | ±10% | X7R | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
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