| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0328-0185-4 | 0805B221K500CT | 3,632 | 0.31 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 220pF/50Vdc, ±10% X7R | 50V | 220pF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0169-0064-6 | C1005X7R1H221KT | 3,244 | 0.49 | | PB-Free | | Multilayer Ceramic Chip Cap 220pF/50Vdc ±10%, X7R | 50V | 220pF | ±10% | X7R | 125°C | 0402 (1005) | TDK | Surface Mount | - |
| 0151-0530-3 | CC0603JRNPO9BN221 | 35,534 | 0.43 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 220pF/50V, ±5%, NPO | 50V | 220pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | YAGEO | Surface Mount | - |
| 0082-0155-8 | CL10C200JB8NNNC | 24,590 | 0.33 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5%, COG | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0169-0159-1 | C1608X8L0J225K080AC | 1 | 8.94 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/6.3Vdc ±10%, X8L, Temperature Stable and General Purpose | 6.3V | 2.2μF | ±10% | X8L | 150°C | 0603 (1608) | TDK | Surface Mount | - |
| 0082-0181-8 | CL21A225KOFNNNE | 0 | 1.46 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16Vdc ±10%, X5R | 16V | 2.2μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0206-8 | CL21B225KOFNFNE | 68,098 | 0.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16V,±10% X7R | 16V | 2.2μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
 | 0033-0010-9 | UVK105CH2R2JW-F | 381 | 2.40 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2pF/50V ±5%, C0H, For High Frequency Applications | 50V | 2.2pF | ±5% | CH | 125°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
| 0328-0180-4 | 0805N222J500CT | 27,570 | 0.66 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2nF/50Vdc,±5%,NP0 | 50V | 2.2nF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 1649-0001-1 | 0402B222K500NT | 4,300 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2nF/50V, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0328-0149-7 | 1206B222K501CT | 10 | 0.83 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2nF/500Vdc,±10%, X7R | 500V | 2.2nF | ±10% | X7R | 125°C | 1206 (3216) | WALSIN | Surface Mount | - |
| 1649-0003-5 | 0402CG2R0C500NT | 7,800 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.0pF/50V, ±0.25pF, COG(NPO) | 50V | 2.0pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0328-0159-3 | 0805B105K500CT | 124,816 | 0.92 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%,X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0082-0178-5 | CL10A105KB8NNNC | 319,116 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%, X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0199-7 | CL21A105KBCLNNC | 0 | 4.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc, ±10% X5R | 50V | 1μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
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