Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0328-0180-4 | 0805N222J500CT | 27,560 | 0.66 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2nF/50Vdc,±5%,NP0 | 50V | 2.2nF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | WALSIN | Surface Mount | - | ||
0160-0101-5 | GRM1555C1H100JZ01D | 26,694 | 0.23 | RoHS | Chip Monolithic Ceramic Cap 10pF/50Vdc ±5%, C0G | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | MURATA | Surface Mount | - | |||
0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0306-0046-3 | C0603C104J5RACTU | 26,154 | 0.58 | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc ±5%,X7R | 50V | 0.1μF | ±5% | X7R | 125°C | 0603 (1608) | KEMET | Surface Mount | - | ||
0306-0072-3 | C0805C101J5GACTU | 25,829 | 0.58 | PB-Free | RoHS | Ceramic Chip Cap 100pF/50Vdc, ±5%,C0G(NPO) | 50V | 100pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | KEMET | Surface Mount | - | ||
0082-0237-9 | CL05B104KO5NNNC | 25,623 | 0.10 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0243-4 | CL10A106MO8NQNC | 25,331 | 0.71 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0160-0686-1 | DE1E3RA472MA4BN01F | 25,163 | 7.00 | PB-Free | RoHS | Safety Standard Ceramic Capacitor 4.7nF/250Vac ±20%,Class X1/Y1,10mm Lead Spacing Vertical Crimp Long Lead | 440Vac/250Vac | 4.7nF | ±20% | E | 125°C | RADIAL | MURATA | Through Hole | 10mm | ||
0151-0384-5 | CC0805JRNPO9BN220 | 25,033 | 0.36 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50V, ±5%, NPO | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | YAGEO | Surface Mount | - | ||
0328-0107-5 | 0603B472K500CT | 24,754 | 0.24 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 4.7nF/50Vdc,±10%,X7R | 50V | 4.7nF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - | ||
0082-0155-8 | CL10C200JB8NNNC | 24,590 | 0.33 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5%, COG | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0328-0109-1 | 0603B224K250CT | 24,212 | 1.08 | PB-Free | Ceramic Chip Cap 0.22 μF/25V, ±10%, X7R | 25V | 0.22μF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - | |||
0092-0112-1 | 06035C103KAT2A | 23,684 | 0.57 | PB-Free | RoHS | Ceramic Chip Cap 10nF/50Vdc, ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | KYOCERA AVX | Surface Mount | - | ||
0328-0177-5 | 1206B104K500CT | 23,429 | 0.61 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc,±10%,X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | WALSIN | Surface Mount | - | ||
0033-0021-6 | LMK212BJ226MG-T | 23,339 | 0.83 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10V, ±20%, X5R, High Dielectric Type | 10V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |