| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0169-0118-3 | C3216X7R1V106M160AC | 0 | 15.17 |  | | RoHS | Multilayer Ceramic Chip Cap 10 μF/35Vdc ±20%, X7R, Temperature Stable and General Purpose | 35V | 10μF | ±20% | X7R | 125°C | 1206 (3216) | TDK | Surface Mount | - |
| 0151-0789-9 | CC0402JRX7R9BB182 | 143 | 0.19 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1.8nF/50V, ±5%, X7R | 50V | 1.8nF | ±5% | X7R | 125°C | 0402 (1005) | YAGEO | Surface Mount | - |
| 1649-0002-3 | 0402CG1R5C500NT | 8,900 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1.5pF/50V, ±0.25pF, COG(NPO) | 50V | 1.5pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0328-0144-2 | 0805B474K500CT | 57,559 | 0.53 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/50Vdc,±10% X7R | 50V | 0.47μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
 | 0033-0046-3 | UMK107B7474KA-TR | 0 | 2.72 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/50V, ±10%, X7R, High Dielectric Type | 50V | 0.47μF | ±10% | X7R | 125°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |
| 0328-0053-8 | 0805B474K250CT | 4,856 | 1.06 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/25Vdc,±10% X7R | 25V | 0.47μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0328-0116-6 | 0805B474K250CT-CT | 746 | 1.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/25Vdc,±10%, X7R | 25V | 0.47μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
 | 0160-0950-1 | LLL31MR71E474MA01L | 9,000 | 5.16 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/25VDC, ±20%, X7R, High Dielectric Constant Type, LW Reversed, Low ESL | 25V | 0.47μF | ±20% | X7R | 125°C | 0612 (1632) | MURATA | Surface Mount | - |
| 0328-0178-7 | 1206B334K500CT | 6,535 | 1.42 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.33μF/50Vdc,±10%, X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 1206 (3216) | WALSIN | Surface Mount | - |
| 0328-0054-1 | 0805B104J500CT | 97,117 | 0.49 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc,±5%,X7R | 50V | 0.1μF | ±5% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0328-0177-5 | 1206B104K500CT | 20,929 | 0.61 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc,±10%,X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | WALSIN | Surface Mount | - |
| 0328-0223-6 | 0603B104J500CT | 11,700 | 0.29 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±5% X7R | 50V | 0.1μF | ±5% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0192-3 | CL21B104KBCNNNC | 757,798 | 0.32 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0193-5 | CL21B104KBCNNNC-CT | 3 | 0.40 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0328-0024-9 | 0603B104K500CT | 289,628 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
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