| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0192-3 | CL21B104KBCNNNC | 776,118 | 0.32 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0193-5 | CL21B104KBCNNNC-CT | 3 | 0.40 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0197-3 | CL10B104KB8NFNC | 22,166 | 0.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0198-5 | CL10C100DB8NNNC | 7,310 | 1.44 | | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0199-7 | CL21A105KBCLNNC | 0 | 4.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc, ±10% X5R | 50V | 1μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0200-6 | CL10C220JB8NNNC | 4,487 | 0.32 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% COG | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0201-8 | CL21B104KCFNNNE | 1,372 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/100Vdc,±10% X7R | 100V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0202-1 | CL21B103KBCNNNC | 525,807 | 0.38 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10nF/50Vdc, ±10% X7R (10000pF) | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0205-6 | CL21B331KBANNNC | 74,793 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 330pF/50Vdc, ±10% X7R | 50V | 330pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0206-8 | CL21B225KOFNFNE | 68,661 | 0.57 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16V,±10% X7R | 16V | 2.2μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0208-2 | CL21B106KOQNNNE | 201,285 | 1.00 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc,±10% X7R | 16V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0210-9 | CL31C300JBCNNNC | 163 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0213-5 | CL21A106KAYNNNE | 341,611 | 0.58 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0214-7 | CL32A226KAJNNNE | 50,815 | 6.31 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/25Vdc, ±10% X5R | 25V | 22μF | ±10% | X5R | 85°C | 1210 (3225) | SAMSUNG | Surface Mount | - |
| 0082-0215-9 | CL31B104KBCNNNC | 67,223 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
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