Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0151-0645-5 | CC0603FRNPO0BN150 | 0 | 2.60 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 15pF/100V,±1%,NPO | 100V | 15pF | ±1% | C0G (NP0) | 125°C | 0603 (1608) | YAGEO | Surface Mount | - | ||
0328-0161-1 | 0805B153J500CT | 53,326 | 1.07 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 15nF/50Vdc, ±5%,X7R | 50V | 15nF | ±5% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - | ||
0306-0225-4 | C0805C151J5GACTU | 7 | 2.69 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 150pF/50Vdc ±5%, C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | KEMET | Surface Mount | - | ||
0306-0238-3 | C0805C130M5HACTU | 14,546 | 1.75 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 13pF/50Vdc, ±20%, X8R | 50V | 13pF | ±20% | X8R | 150°C | 0805 (2012) | KEMET | Surface Mount | - | ||
0328-0200-4 | 0805N120J500CT | 544 | 0.29 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 12pF/50Vdc, ±5% NP0 (C0G) | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | WALSIN | Surface Mount | - | ||
0169-0089-9 | C1005C0G1H120J050BA | 3,580 | 0.57 | RoHS | Multilayer Ceramic Chip Cap 12pF/50Vdc ±5%, C0G | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | TDK | Surface Mount | - | |||
0169-0066-2 | C0402C0G1C120J | 3,028 | 3.00 | PB-Free | Multilayer Ceramic Chip Cap 12pF/16Vdc ±5%, C0G | 16V | 12pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | TDK | Surface Mount | - | |||
0151-0791-6 | CC0603KRX7R9BB123 | 3,600 | 0.18 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 12nF/50V, ±10%, X7R | 50V | 12nF | ±10% | X7R | 125°C | 0603 (1608) | YAGEO | Surface Mount | - | ||
0834-0005-9 | TS18001V106K8TX00R | 19,287 | 0.66 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/35Vdc, ±10%, X5R | 35V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SUNTAN | Surface Mount | - | ||
0169-0125-8 | C2012JB1V106K085AC | 0 | 6.11 | RoHS | Multilayer Ceramic Chip Cap 10μF/35Vdc ±10%, JB, Temperature Stable and General Purpose | 35V | 10μF | ±10% | JB | 85°C | 0805 (2012) | TDK | Surface Mount | - | |||
0328-0150-4 | 0805X106K250CT | 47,863 | 1.38 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc,±10%,X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | WALSIN | Surface Mount | - | ||
0082-0213-5 | CL21A106KAYNNNE | 338,924 | 0.58 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0208-2 | CL21B106KOQNNNE | 200,985 | 1.00 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc,±10% X7R | 16V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0169-0169-4 | C3216X7R1C106KT000N | 12,770 | 1.94 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc ±10%, X7R, Temperature Stable and General Purpose | 16V | 10μF | ±10% | X7R | 125°C | 1206 (3216) | TDK | Surface Mount | - | ||
0033-0063-3 | LMK212BJ106KG-T | 35,739 | 0.63 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/10V, ±10%, X5R, High Dielectric Type | 10V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |