Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0160-0293-1 | GRM1882C1H101JA01D | 983,698 | 0.74 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 100pF/50Vdc, ±5%, Temperature Characteristic CH (JIS) | 50V | 100pF | ±5% | CH | 125°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0082-0192-3 | CL21B104KBCNNNC | 800,877 | 0.31 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0224-1 | CL10B104KB8NNNC | 725,410 | 0.12 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
1674-0036-1 | GRM188R71H104KA93D | 662,940 | 0.20 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0082-0202-1 | CL21B103KBCNNNC | 529,232 | 0.37 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10nF/50Vdc, ±10% X7R (10000pF) | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0092-0090-2 | 06035C104KAT2A | 444,424 | 0.65 | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc,±10%,X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | KYOCERA AVX | Surface Mount | - | ||
0160-0294-3 | GRM188R72D102KW07D | 399,370 | 1.19 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 1nF/200Vdc, ±10%, X7R | 200V | 1nF | ±10% | X7R | 125°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0160-0662-6 | GRM188R6YA475KE15D | 389,767 | 1.95 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 4.7μF/35Vdc, ±10% X5R | 35V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0082-0213-5 | CL21A106KAYNNNE | 355,501 | 0.56 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0328-0043-4 | 0805B104K500CT | 353,525 | 0.20 | PB-Free | RoHS | Chip Cap 0.1μF/50Vdc,±10%,X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - | ||
0328-0047-6 | 0402B103K250CT | 353,157 | 0.05 | PB-Free | RoHS | Chip Cap 10nF/25Vdc, ±10%, X7R | 25V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | WALSIN | Surface Mount | - | ||
0082-0178-5 | CL10A105KB8NNNC | 344,288 | 0.21 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%, X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0328-0024-9 | 0603B104K500CT | 291,678 | 0.20 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - | ||
0082-0208-2 | CL21B106KOQNNNE | 206,982 | 1.00 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc,±10% X7R | 16V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0328-0163-4 | 0603N220J500CT | 199,750 | 0.13 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% NP0 (C0G), General Purpose | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |