| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0033-0010-9 | UVK105CH2R2JW-F | 381 | 2.33 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2pF/50V ±5%, C0H, For High Frequency Applications | 50V | 2.2pF | ±5% | CH | 125°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
 | 0033-0021-6 | LMK212BJ226MG-T | 24,070 | 0.80 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10V, ±20%, X5R, High Dielectric Type | 10V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |
| 0033-0046-3 | UMK107B7474KA-TR | 0 | 2.57 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/50V, ±10%, X7R, High Dielectric Type | 50V | 0.47μF | ±10% | X7R | 125°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |
| 0033-0059-2 | UMK105BJ471KV-F | 2,000 | 0.53 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50V, ±10%, X5R/B (EIA/JIS), High Dielectric Type | 50V | 470pF | ±10% | X5R | 85°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
| 0033-0063-3 | LMK212BJ106KG-T | 36,259 | 0.60 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/10V, ±10%, X5R, High Dielectric Type | 10V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |
| 0033-0070-1 | EMK107B7105KA-T | 1,600 | 0.24 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/16V, ±10%, X7R, High Dielectric Type | 16V | 1μF | ±10% | X7R | 125°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |
 | 0082-0149-6 | CL21B471KBANNNC | 12,652 | 0.37 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0150-3 | CL21B152KBANNNC | 1,153 | 0.18 | | PB-Free | | Multilayer Ceramic Chip Cap, 1.5nF/50Vdc, ±10%, X7R | 50V | 1.5nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0154-5 | CL10C300JB8NNNC | 0 | 0.08 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0155-8 | CL10C200JB8NNNC | 28,610 | 0.33 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5%, COG | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0158-7 | CL21C100DBANNNC | 31,899 | 0.27 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0163-6 | CL31A226KPHNNNE | 23,703 | 1.60 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10Vdc,±10%, X5R | 10V | 22μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0165-2 | CL21B105KBFNNNE | 30,146 | 0.52 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0168-1 | CL10C100JB8NNNC | 39,578 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±5% COG | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0176-9 | CL21A226MAQNNNE | 12,258 | 0.87 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±20%, X5R | 25V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
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