Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0160-0293-1 | GRM1882C1H101JA01D | 983,698 | 0.76 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 100pF/50Vdc, ±5%, Temperature Characteristic CH (JIS) | 50V | 100pF | ±5% | CH | 125°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0082-0192-3 | CL21B104KBCNNNC | 775,794 | 0.32 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0224-1 | CL10B104KB8NNNC | 682,470 | 0.12 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
1674-0036-1 | GRM188R71H104KA93D | 642,840 | 0.20 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0082-0202-1 | CL21B103KBCNNNC | 526,061 | 0.38 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10nF/50Vdc, ±10% X7R (10000pF) | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0092-0090-2 | 06035C104KAT2A | 445,774 | 0.72 | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc,±10%,X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | KYOCERA AVX | Surface Mount | - | ||
0160-0294-3 | GRM188R72D102KW07D | 399,370 | 1.25 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 1nF/200Vdc, ±10%, X7R | 200V | 1nF | ±10% | X7R | 125°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0160-0662-6 | GRM188R6YA475KE15D | 389,767 | 1.95 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 4.7μF/35Vdc, ±10% X5R | 35V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0082-0213-5 | CL21A106KAYNNNE | 354,235 | 0.58 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0328-0047-6 | 0402B103K250CT | 353,157 | 0.06 | PB-Free | RoHS | Chip Cap 10nF/25Vdc, ±10%, X7R | 25V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | WALSIN | Surface Mount | - | ||
0328-0043-4 | 0805B104K500CT | 330,757 | 0.20 | PB-Free | RoHS | Chip Cap 0.1μF/50Vdc,±10%,X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - | ||
0082-0178-5 | CL10A105KB8NNNC | 319,116 | 0.21 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%, X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0328-0024-9 | 0603B104K500CT | 291,628 | 0.21 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - | ||
0160-0304-1 | RDER71H104K0M1H03A | 276,878 | 1.83 | PB-Free | RoHS | Radial Lead Ceramic Capacitor 0.1μF/50VDC ±10% X7R,Lead Spacing 5.0mm,Inside Crimp Lead for General Use | 50V | 0.1μF | ±10% | X7R | 125°C | RADIAL | MURATA | Through Hole | 5mm | ||
0082-0208-2 | CL21B106KOQNNNE | 204,944 | 1.00 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc,±10% X7R | 16V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |