| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0160-0937-9 | GRM21BR70J106KA73L | 103,250 | 1.20 |  | PB-Free | RoHS | Chip Monolithic Ceramic Cap 10μF/6.3Vdc, ±10% X7R | 6.3V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | MURATA | Surface Mount | - |
| 0328-0054-1 | 0805B104J500CT | 100,127 | 0.46 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc,±5%,X7R | 50V | 0.1μF | ±5% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
 | 0160-0745-1 | DE2E3KY332MN3AM02F | 96,560 | 2.61 | | PB-Free | | Safety Standard Ceramic Capacitors 3.3nF/250Vac, ±20%, Class X1/Y2, 7.5mm Lead Spacing, Vertical Crimp Taping Type | 250Vac | 3.3nF | ±20% | E | 125°C | RADIAL | MURATA | Through Hole | 7.5mm |
 | 0158-0018-3 | S104ZYFE072L | 84,952 | 1.00 | | PB-Free | RoHS | Ceramic Disc Cap 0.1μF/50V,+80%/-20% Dia 7.5mm | 50V | 0.1μF | +80%/-20% | Y5V | 85°C | RADIAL | AEC | Through Hole | 5mm |
| 0082-0265-4 | CL10A475KO8NNNC | 82,886 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0205-6 | CL21B331KBANNNC | 81,693 | 0.26 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 330pF/50Vdc, ±10% X7R | 50V | 330pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 1674-0041-4 | GRM188B31H104KA92D | 79,950 | 0.41 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.1μF/50Vdc, ±10%, Temperature Characteristic B (JIS) | 50V | 0.1μF | ±10% | B | 85°C | 0603 (1608) | MURATA | Surface Mount | - |
 | 0834-0003-5 | TS170R1H333ZSBFA0R | 76,523 | 0.90 | | PB-Free | RoHS | Multilayer (Mono) Ceramic Capacitor, 33nF/50V, +80%/-20%, Y5V, Radial, Pitch 2.54mm. | 50V | 33nF | +80%/-20% | Y5V | 85°C | RADIAL | SUNTAN | Through Hole | 2.54mm |
| 0328-0082-7 | 0603B105K160CT | 72,546 | 0.35 | | PB-Free | | Ceramic Chip Cap 1μF/16Vdc, ±10%, X7R | 16V | 1μF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0169-0180-2 | C1608C0G1H101JT000N | 72,317 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 100pF/50Vdc, ±5%, C0G | 50V | 100pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | TDK | Surface Mount | - |
| 0082-0206-8 | CL21B225KOFNFNE | 68,148 | 0.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16V,±10% X7R | 16V | 2.2μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0215-9 | CL31B104KBCNNNC | 67,413 | 0.58 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0092-0004-8 | 08055C104KAT2A | 66,024 | 0.31 | | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0834-0006-1 | TS18001V475K6TX00R | 63,710 | 0.92 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 4.7μF/35Vdc, ±10%, X5R | 35V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SUNTAN | Surface Mount | - |
| 0328-0186-6 | 0402N330J500CT | 62,576 | 0.07 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 33pF/50Vdc, ±5% NP0 (C0G) | 50V | 33pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
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