Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0082-0262-8 | CL10C120JB8NNNC | 6,310 | 0.26 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 12pF/50Vdc, ±5%, COG | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0168-1 | CL10C100JB8NNNC | 28,003 | 0.22 | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±5% COG | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0198-5 | CL10C100DB8NNNC | 7,310 | 1.44 | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0283-6 | CL10B223KB8NNNC | 3,074 | 0.53 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22nF/50Vdc, ±10%, X7R | 50V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0246-1 | CL10B222KB8NFNC | 1,737 | 0.74 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2nF/50Vdc, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0224-1 | CL10B104KB8NNNC | 677,087 | 0.12 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0197-3 | CL10B104KB8NFNC | 25,343 | 0.13 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0223-8 | CL10B103KB8NNNC | 105,538 | 0.14 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10% X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0265-4 | CL10A475KO8NNNC | 81,821 | 0.28 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0247-2 | CL10A226MQ8NRNC | 696 | 0.59 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0290-3 | CL10A225KL8NNNC | 3,310 | 1.17 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/35Vdc, ±10%, X5R | 35V | 2.2μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0243-4 | CL10A106MO8NQNC | 24,621 | 0.71 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0178-5 | CL10A105KB8NNNC | 298,867 | 0.21 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%, X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0237-9 | CL05B104KO5NNNC | 21,076 | 0.10 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |