| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0228-8 | CL21A475KBQNNNE | 52,723 | 0.78 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/50Vdc, ±10% X5R | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0176-9 | CL21A226MAQNNNE | 23,830 | 0.90 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±20%, X5R | 25V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0181-8 | CL21A225KOFNNNE | 0 | 1.46 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16Vdc ±10%, X5R | 16V | 2.2μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0213-5 | CL21A106KAYNNNE | 338,924 | 0.58 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0199-7 | CL21A105KBCLNNC | 0 | 4.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc, ±10% X5R | 50V | 1μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0263-1 | CL10C750JB8NNNC | 143,580 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 75pF/50Vdc, ±5%, COG | 50V | 75pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0261-6 | CL10C4R7BB8NNNC | 15,615 | 0.97 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7pF/50Vdc, ±0.1pF COG | 50V | 4.7pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0270-7 | CL10C3R9BB8NNNC | 28,168 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0256-3 | CL10C3R3BB8NNNC | 14,534 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0154-5 | CL10C300JB8NNNC | 0 | 0.10 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0271-9 | CL10C2R7CB8NNNC | 11,101 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc,±0.25pF COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0200-6 | CL10C220JB8NNNC | 64,375 | 0.32 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% COG | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0155-8 | CL10C200JB8NNNC | 19,242 | 0.33 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5%, COG | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0248-4 | CL10C151JB8NNNC | 14,630 | 0.75 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
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