| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0187-1 | CL31A106KBHNNNE | 107,879 | 1.13 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/50Vdc, ±10%, X5R | 50V | 10μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0158-7 | CL21C100DBANNNC | 29,344 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0227-6 | CL21B473KBCNNNC | 12,930 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0190-9 | CL21B471KBANNNC-CT | 131 | 0.36 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0149-6 | CL21B471KBANNNC | 9,107 | 0.39 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0226-4 | CL21B334KBFNNNE | 6,083 | 0.63 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.33μF/50Vdc, ±10% X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0205-6 | CL21B331KBANNNC | 74,693 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 330pF/50Vdc, ±10% X7R | 50V | 330pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0206-8 | CL21B225KOFNFNE | 68,293 | 0.57 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16V,±10% X7R | 16V | 2.2μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0150-3 | CL21B152KBANNNC | 12,180 | 0.34 | | PB-Free | | Multilayer Ceramic Chip Cap, 1.5nF/50Vdc, ±10%, X7R | 50V | 1.5nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0208-2 | CL21B106KOQNNNE | 200,985 | 1.00 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc,±10% X7R | 16V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0165-2 | CL21B105KBFNNNE | 77,912 | 0.54 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0201-8 | CL21B104KCFNNNE | 1,342 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/100Vdc,±10% X7R | 100V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0193-5 | CL21B104KBCNNNC-CT | 3 | 0.40 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0192-3 | CL21B104KBCNNNC | 757,798 | 0.32 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0202-1 | CL21B103KBCNNNC | 526,090 | 0.38 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10nF/50Vdc, ±10% X7R (10000pF) | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
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