Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0092-0090-2 | 06035C104KAT2A | 445,106 | 0.72 | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc,±10%,X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | KYOCERA AVX | Surface Mount | - | ||
0082-0202-1 | CL21B103KBCNNNC | 526,200 | 0.38 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10nF/50Vdc, ±10% X7R (10000pF) | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
1674-0036-1 | GRM188R71H104KA93D | 629,740 | 0.20 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | MURATA | Surface Mount | - | ||
0082-0224-1 | CL10B104KB8NNNC | 680,037 | 0.12 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0192-3 | CL21B104KBCNNNC | 761,614 | 0.32 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0160-0293-1 | GRM1882C1H101JA01D | 875,698 | 0.76 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 100pF/50Vdc, ±5%, Temperature Characteristic CH (JIS) | 50V | 100pF | ±5% | CH | 125°C | 0603 (1608) | MURATA | Surface Mount | - |