| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 1674-0041-4 | GRM188B31H104KA92D | 79,950 | 0.42 |  | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.1μF/50Vdc, ±10%, Temperature Characteristic B (JIS) | 50V | 0.1μF | ±10% | B | 85°C | 0603 (1608) | MURATA | Surface Mount | - |
| 0082-0265-4 | CL10A475KO8NNNC | 81,821 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0092-0003-5 | 08055C103KAT2A | 94,440 | 0.81 | | PB-Free | RoHS | Ceramic Chip Cap 10nF/50Vdc ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
 | 0160-0745-1 | DE2E3KY332MN3AM02F | 96,560 | 2.76 | | PB-Free | | Safety Standard Ceramic Capacitors 3.3nF/250Vac, ±20%, Class X1/Y2, 7.5mm Lead Spacing, Vertical Crimp Taping Type | 250Vac | 3.3nF | ±20% | E | 125°C | RADIAL | MURATA | Through Hole | 7.5mm |
| 0328-0054-1 | 0805B104J500CT | 97,117 | 0.49 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc,±5%,X7R | 50V | 0.1μF | ±5% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0160-0937-9 | GRM21BR70J106KA73L | 103,250 | 1.09 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 10μF/6.3Vdc, ±10% X7R | 6.3V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | MURATA | Surface Mount | - |
| 0160-0158-6 | GRM1555C1H100JA01D | 105,437 | 0.20 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 10pF/50Vdc ±5%, C0G for General Purpose, Temperature Compensating Type | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0082-0223-8 | CL10B103KB8NNNC | 105,588 | 0.14 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10% X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0328-0033-0 | 0603B103K500CT | 107,303 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.01μF/50Vdc,±10% X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0187-1 | CL31A106KBHNNNE | 108,079 | 1.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/50Vdc, ±10%, X5R | 50V | 10μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 1721-0005-5 | 0603YC104KAT2A | 115,038 | 0.14 | | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/16Vdc ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | KYOCERA AVX | Surface Mount | - |
| 0834-0008-5 | TS18001E105K6TB00R | 119,950 | 0.25 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/25Vdc, ±10%, X7R | 25V | 1μF | ±10% | X7R | 125°C | 0603 (1608) | SUNTAN | Surface Mount | - |
| 0328-0159-3 | 0805B105K500CT | 123,390 | 0.92 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%,X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0082-0263-1 | CL10C750JB8NNNC | 143,580 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 75pF/50Vdc, ±5%, COG | 50V | 75pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0160-1019-6 | GRM0335C1H180JA01D | 149,700 | 0.06 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 18pF/50Vdc, ±5%, C0G | 50V | 18pF | ±5% | C0G (NP0) | 125°C | 0201 (0603) | MURATA | Surface Mount | - |
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