| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0266-6 | CL05A106MQ5NUNC | 9,161 | 0.28 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/6.3Vdc, ±20%, X5R | 6.3V | 10μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0160-0572-5 | GRM21BR61A476ME15L | 9,136 | 6.81 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 47μF/10Vdc, ±20%, X5R | 10V | 47μF | ±20% | X5R | 85°C | 0805 (2012) | MURATA | Surface Mount | - |
| 0082-0149-6 | CL21B471KBANNNC | 9,107 | 0.39 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0328-0079-4 | 0402N1R8B500LT | 9,089 | 0.17 | | PB-Free | | Ceramic Chip Cap 1.8pF/50Vdc, ±0.1pF, NPO | 50V | 1.8pF | ±0.1pF | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
 | 0160-1049-5 | GJM1555C1HR40WB01D-T | 9,040 | 0.64 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.4pF/50Vdc, Tolerance ±0.05pF, C0G, High Q for General Purpose | 50V | 0.4pF | ±0.05pF | C0G (NP0) | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
 | 0160-0950-1 | LLL31MR71E474MA01L | 9,000 | 5.16 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/25VDC, ±20%, X7R, High Dielectric Constant Type, LW Reversed, Low ESL | 25V | 0.47μF | ±20% | X7R | 125°C | 0612 (1632) | MURATA | Surface Mount | - |
| 0092-0412-8 | 04025C104KAT2A | 9,000 | 0.41 | | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - |
| 0328-0218-3 | 0805N561J500CT | 8,957 | 0.45 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 560pF/50Vdc, ±5% NP0 (C0G) | 50V | 560pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0160-1032-8 | GRM21BR61E106KA73L | 8,950 | 1.25 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | MURATA | Surface Mount | - |
| 1649-0002-3 | 0402CG1R5C500NT | 8,900 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1.5pF/50V, ±0.25pF, COG(NPO) | 50V | 1.5pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
 | 0158-0308-9 | H103MYFE062AF | 8,878 | 1.10 | | PB-Free | RoHS | Ceramic Disc Cap 10nF/50Vdc, ±20%, Y5V, Class II, Diameter 6.5mm MAX, Tape Inward Kink | 50V | 10nF | ±20% | Y5V | 85°C | RADIAL | AEC | Through Hole | 5mm |
| 0092-0400-1 | 04025A101JAT2A | 8,850 | 0.17 | | PB-Free | RoHS | Ceramic Chip Cap 100pF/50Vdc ±5%, C0G(NP0) | 50V | 100pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - |
| 0328-0135-1 | 0805B473K500CT | 8,848 | 0.37 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 47nF/50V ±10%, X7R General Purpose | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0160-0968-1 | GRM188R72A223KAC4D | 8,814 | 0.57 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 22nF/100Vdc, ±10% X7R | 100V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | MURATA | Surface Mount | - |
| 0082-0210-9 | CL31C300JBCNNNC | 8,783 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
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