| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0214-7 | CL32A226KAJNNNE | 50,812 | 6.31 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/25Vdc, ±10% X5R | 25V | 22μF | ±10% | X5R | 85°C | 1210 (3225) | SAMSUNG | Surface Mount | - |
| 0082-0215-9 | CL31B104KBCNNNC | 67,013 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0223-8 | CL10B103KB8NNNC | 105,538 | 0.14 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10% X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0224-1 | CL10B104KB8NNNC | 676,987 | 0.12 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0226-4 | CL21B334KBFNNNE | 6,083 | 0.63 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.33μF/50Vdc, ±10% X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0227-6 | CL21B473KBCNNNC | 12,930 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0228-8 | CL21A475KBQNNNE | 52,723 | 0.78 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/50Vdc, ±10% X5R | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0237-9 | CL05B104KO5NNNC | 21,076 | 0.10 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0243-4 | CL10A106MO8NQNC | 24,621 | 0.71 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0244-6 | CL05A474KA5NNNC | 8,354 | 1.08 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.47μF/25Vdc, ±10%, X5R | 25V | 0.47μF | ±10% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0246-1 | CL10B222KB8NFNC | 1,737 | 0.74 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2nF/50Vdc, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0247-2 | CL10A226MQ8NRNC | 696 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0248-4 | CL10C151JB8NNNC | 14,630 | 0.75 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0256-3 | CL10C3R3BB8NNNC | 14,534 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
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