Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0082-0192-3 | CL21B104KBCNNNC | 776,118 | 0.32 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0190-9 | CL21B471KBANNNC-CT | 131 | 0.36 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0187-1 | CL31A106KBHNNNE | 108,109 | 1.13 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/50Vdc, ±10%, X5R | 50V | 10μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - | ||
0082-0181-8 | CL21A225KOFNNNE | 0 | 1.46 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16Vdc ±10%, X5R | 16V | 2.2μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0178-5 | CL10A105KB8NNNC | 318,077 | 0.21 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%, X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0176-9 | CL21A226MAQNNNE | 950 | 0.90 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±20%, X5R | 25V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0168-1 | CL10C100JB8NNNC | 29,408 | 0.22 | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±5% COG | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0165-2 | CL21B105KBFNNNE | 28,432 | 0.54 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0163-6 | CL31A226KPHNNNE | 21,279 | 1.69 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10Vdc,±10%, X5R | 10V | 22μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - | ||
0082-0158-7 | CL21C100DBANNNC | 29,344 | 0.28 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0155-8 | CL10C200JB8NNNC | 24,590 | 0.33 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5%, COG | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0154-5 | CL10C300JB8NNNC | 0 | 0.10 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0150-3 | CL21B152KBANNNC | 12,353 | 0.34 | PB-Free | Multilayer Ceramic Chip Cap, 1.5nF/50Vdc, ±10%, X7R | 50V | 1.5nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | |||
0082-0149-6 | CL21B471KBANNNC | 13,107 | 0.39 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0033-0070-1 | EMK107B7105KA-T | 100 | 0.24 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/16V, ±10%, X7R, High Dielectric Type | 16V | 1μF | ±10% | X7R | 125°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |