| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0154-5 | CL10C300JB8NNNC | 0 | 0.10 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0155-8 | CL10C200JB8NNNC | 19,242 | 0.33 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5%, COG | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0158-7 | CL21C100DBANNNC | 29,344 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0200-6 | CL10C220JB8NNNC | 64,375 | 0.32 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% COG | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0168-1 | CL10C100JB8NNNC | 28,003 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±5% COG | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0198-5 | CL10C100DB8NNNC | 7,310 | 1.44 | | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0210-9 | CL31C300JBCNNNC | 8,783 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0248-4 | CL10C151JB8NNNC | 14,630 | 0.75 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0256-3 | CL10C3R3BB8NNNC | 14,534 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0270-7 | CL10C3R9BB8NNNC | 28,168 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0271-9 | CL10C2R7CB8NNNC | 11,101 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc,±0.25pF COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0261-6 | CL10C4R7BB8NNNC | 15,615 | 0.97 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7pF/50Vdc, ±0.1pF COG | 50V | 4.7pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0262-8 | CL10C120JB8NNNC | 6,300 | 0.26 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 12pF/50Vdc, ±5%, COG | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
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