| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0092-0003-5 | 08055C103KAT2A | 103,540 | 0.81 |  | PB-Free | RoHS | Ceramic Chip Cap 10nF/50Vdc ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0092-0004-8 | 08055C104KAT2A | 66,024 | 0.32 | | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0092-0035-3 | 08055A220JAT2A | 53,322 | 0.97 | | PB-Free | RoHS | Ceramic Chip Cap 22pF/50Vdc ±5%, C0G(NP0) | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0092-0036-6 | 08055A101JAT2A | 0 | 1.70 | | PB-Free | RoHS | Ceramic Chip Cap 100pF/50Vdc ±5%, C0G(NP0) | 50V | 100pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0082-0202-1 | CL21B103KBCNNNC | 523,857 | 0.38 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10nF/50Vdc, ±10% X7R (10000pF) | 50V | 10nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0205-6 | CL21B331KBANNNC | 81,691 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 330pF/50Vdc, ±10% X7R | 50V | 330pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0215-9 | CL31B104KBCNNNC | 67,373 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0223-8 | CL10B103KB8NNNC | 119,664 | 0.14 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10% X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0224-1 | CL10B104KB8NNNC | 682,970 | 0.12 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0226-4 | CL21B334KBFNNNE | 6,093 | 0.63 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.33μF/50Vdc, ±10% X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0227-6 | CL21B473KBCNNNC | 12,930 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0228-8 | CL21A475KBQNNNE | 54,406 | 0.78 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/50Vdc, ±10% X5R | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0210-9 | CL31C300JBCNNNC | 313 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0246-1 | CL10B222KB8NFNC | 1,787 | 0.74 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2nF/50Vdc, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
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