| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0092-0415-4 | 04026D105KAT2A | 18,700 | 0.32 |  | PB-Free | RoHS | Ceramic Chip Cap 1μF/6.3Vdc ±10%, X5R | 6.3V | 1μF | ±10% | X5R | 85°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - |
| 0092-0422-1 | 0402ZD104KAT2A | 9,900 | 0.16 | | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/10Vdc ±10%, X5R | 10V | 0.1μF | ±10% | X5R | 85°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - |
| 0092-0423-3 | 0402ZD105KAT2A | 14,620 | 0.62 | | PB-Free | RoHS | Ceramic Chip Cap 1μF/10Vdc ±10%, X5R | 10V | 1μF | ±10% | X5R | 85°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - |
| 0082-0247-2 | CL10A226MQ8NRNC | 696 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0213-5 | CL21A106KAYNNNE | 338,924 | 0.58 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0214-7 | CL32A226KAJNNNE | 50,812 | 6.31 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/25Vdc, ±10% X5R | 25V | 22μF | ±10% | X5R | 85°C | 1210 (3225) | SAMSUNG | Surface Mount | - |
| 0082-0228-8 | CL21A475KBQNNNE | 52,723 | 0.78 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/50Vdc, ±10% X5R | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0199-7 | CL21A105KBCLNNC | 0 | 4.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc, ±10% X5R | 50V | 1μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0176-9 | CL21A226MAQNNNE | 23,830 | 0.90 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±20%, X5R | 25V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0178-5 | CL10A105KB8NNNC | 298,867 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%, X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0181-8 | CL21A225KOFNNNE | 0 | 1.46 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16Vdc ±10%, X5R | 16V | 2.2μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0187-1 | CL31A106KBHNNNE | 107,879 | 1.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/50Vdc, ±10%, X5R | 50V | 10μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0290-3 | CL10A225KL8NNNC | 3,310 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/35Vdc, ±10%, X5R | 35V | 2.2μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0243-4 | CL10A106MO8NQNC | 24,621 | 0.71 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0244-6 | CL05A474KA5NNNC | 8,354 | 1.08 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.47μF/25Vdc, ±10%, X5R | 25V | 0.47μF | ±10% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
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