| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0092-0094-4 | 08055C104JAT2A | 3,215 | 1.26 |  | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc, ±5%, X7R | 50V | 0.1μF | ±5% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0092-0095-7 | 08055C224KAT2A | 138 | 0.82 | | PB-Free | RoHS | Ceramic Chip Cap 0.22μF/50Vdc ±10%, X7R | 50V | 0.22μF | ±10% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0092-0102-7 | 08055C333KAT2A | 21 | 0.70 | | PB-Free | RoHS | Ceramic Chip Cap 33nF/50Vdc ±10%, X7R | 50V | 33nF | ±10% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0082-0190-9 | CL21B471KBANNNC-CT | 131 | 0.36 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0192-3 | CL21B104KBCNNNC | 757,798 | 0.32 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0193-5 | CL21B104KBCNNNC-CT | 3 | 0.40 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc, ±10% X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0158-7 | CL21C100DBANNNC | 29,344 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0181-8 | CL21A225KOFNNNE | 0 | 1.46 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2μF/16Vdc ±10%, X5R | 16V | 2.2μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0199-7 | CL21A105KBCLNNC | 0 | 4.69 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc, ±10% X5R | 50V | 1μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0165-2 | CL21B105KBFNNNE | 77,912 | 0.54 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0176-9 | CL21A226MAQNNNE | 23,830 | 0.90 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±20%, X5R | 25V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0149-6 | CL21B471KBANNNC | 9,107 | 0.39 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0150-3 | CL21B152KBANNNC | 12,180 | 0.34 | | PB-Free | | Multilayer Ceramic Chip Cap, 1.5nF/50Vdc, ±10%, X7R | 50V | 1.5nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0213-5 | CL21A106KAYNNNE | 338,924 | 0.58 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0226-4 | CL21B334KBFNNNE | 6,083 | 0.63 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.33μF/50Vdc, ±10% X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
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