| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0160-1183-9 | GRM155R71H472KA01J | 0 | 0.10 |  | PB-Free | RoHS | Chip Monolithic Ceramic Cap 4.7nF/50Vdc, ±10%, X7R | 50V | 4.7nF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0160-0027-6 | GRM155R71E103KA01D | 6,050 | 0.10 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 10nF/25Vdc, ±10%, X7R | 25V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0082-0154-5 | CL10C300JB8NNNC | 0 | 0.10 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0237-9 | CL05B104KO5NNNC | 25,723 | 0.10 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0160-0863-6 | GRM155R61E104KA87D | 3,200 | 0.11 | | | | Chip Monolithic Ceramic Cap 0.1μF/25VDC, ±10%, X5R | 25V | 0.1μF | ±10% | X5R | 85°C | 0402 (1005) | MURATA | Surface Mount | - |
| 1674-0056-7 | GRM155R71H102JA01D | 0 | 0.11 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 1nF/50Vdc, ±5%, X7R | 50V | 1nF | ±5% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 1674-0012-7 | GRM155R71C104KA88D | 450 | 0.11 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0160-0487-4 | GRM155R71H392KA01D | 5,336 | 0.12 | | | RoHS | Chip Monolithic Ceramic Cap 3900pF/50VDC,±10% X7R, Height 0.5mm | 50V | 3.9nF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0082-0224-1 | CL10B104KB8NNNC | 682,670 | 0.12 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0328-0066-1 | 0402B223K160CT | 16,685 | 0.12 | | PB-Free | | Chip Cap 22nF/16Vdc, ±10% | 16V | 22nF | ±10% | X7R | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 0328-0046-3 | 0402B104K100CT | 35,910 | 0.13 | | PB-Free | RoHS | Multilayer Chip Capacitor MLCC 0.1μF/10Vdc, ±10% | 10V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 0328-0163-4 | 0603N220J500CT | 195,550 | 0.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% NP0 (C0G), General Purpose | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 1649-0006-1 | 0402CG470J500NT | 9,770 | 0.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 47pF/50V, ±5%, COG(NPO) | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 1649-0008-5 | 0402B102K500NT | 263 | 0.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1nF/50V, ±10%, X7R | 50V | 1nF | ±10% | X7R | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0082-0197-3 | CL10B104KB8NFNC | 22,366 | 0.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
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