| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 1674-0012-7 | GRM155R71C104KA88D | 450 | 0.11 |  | PB-Free | RoHS | Chip Monolithic Ceramic Cap 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0160-0027-6 | GRM155R71E103KA01D | 6,050 | 0.10 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 10nF/25Vdc, ±10%, X7R | 25V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0160-1183-9 | GRM155R71H472KA01J | 0 | 0.10 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 4.7nF/50Vdc, ±10%, X7R | 50V | 4.7nF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 1674-0058-1 | GRM0335C1E200JA01D | 0 | 0.09 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 20pF/25Vdc, ±5%, C0G | 25V | 20pF | ±5% | C0G (NP0) | 125°C | 0201 (0603) | MURATA | Surface Mount | - |
| 0151-0792-8 | CC0402KRX7R8BB682 | 9,800 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 6.8nF/25V, ±10%, X7R | 25V | 6.8nF | ±10% | X7R | 125°C | 0402 (1005) | YAGEO | Surface Mount | - |
| 0082-0237-9 | CL05B104KO5NNNC | 25,973 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 1649-0001-1 | 0402B222K500NT | 4,300 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2nF/50V, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 1649-0002-3 | 0402CG1R5C500NT | 8,900 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1.5pF/50V, ±0.25pF, COG(NPO) | 50V | 1.5pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 1649-0003-5 | 0402CG2R0C500NT | 7,800 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.0pF/50V, ±0.25pF, COG(NPO) | 50V | 2.0pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0328-0081-4 | 0402N4R7C500LT | 7,226 | 0.09 | | PB-Free | | Multilayer Ceramic Chip Cap,4.7pF/50Vdc,±0.25pF NP0 (C0G) | 50V | 4.7pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 0082-0154-5 | CL10C300JB8NNNC | 0 | 0.08 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0160-0903-2 | GRM155R71C103KA01D | 4,038 | 0.07 | | PB-Free | | Chip Monolithic Ceramic Cap 10nF/16Vdc, ±10% X7R | 16V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0328-0186-6 | 0402N330J500CT | 62,576 | 0.07 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 33pF/50Vdc, ±5% NP0 (C0G) | 50V | 33pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 1649-0005-9 | 0402CG101J500NT | 9,718 | 0.06 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 100pF/50V, ±5%, COG(NPO) | 50V | 100pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0328-0222-4 | 0402N101J500LT | 9,700 | 0.06 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 100pF/50Vdc, ±5%, NP0 (C0G) | 50V | 100pF | ±5% | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
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