| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0328-0081-4 | 0402N4R7C500LT | 7,226 | 0.09 |  | PB-Free | | Multilayer Ceramic Chip Cap,4.7pF/50Vdc,±0.25pF NP0 (C0G) | 50V | 4.7pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 1649-0009-7 | 0402CG4R7C500NT | 10,043 | 0.14 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 4.7pF/50V, ±0.25pF, COG(NPO) | 50V | 4.7pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0082-0270-7 | CL10C3R9BB8NNNC | 28,268 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0092-0406-3 | 04025A3R9BAT2A | 10,000 | 0.33 | | PB-Free | RoHS | Ceramic Chip Cap 3.9pF/50Vdc ±0.1pF, C0G(NP0) | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - |
 | 0493-0011-6 | 201R14S3R9BV4T | 2 | 1.87 | | | RoHS | Multi-Layer Chip Cap 3.9pF/200Vdc, ±0.1pF, NPO Ultra-High Q | 200V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | JOHANSON | Surface Mount | - |
| 0082-0256-3 | CL10C3R3BB8NNNC | 14,634 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0160-0571-3 | GRM1555C1H2R9WA01D | 235 | 2.05 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 2.9pF/50Vdc,±0.05pF C0G,General purpose | 50V | 2.9pF | ±0.05pF | C0G (NP0) | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0082-0271-9 | CL10C2R7CB8NNNC | 11,101 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc,±0.25pF COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
 | 0033-0010-9 | UVK105CH2R2JW-F | 381 | 2.33 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2pF/50V ±5%, C0H, For High Frequency Applications | 50V | 2.2pF | ±5% | CH | 125°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
| 1649-0003-5 | 0402CG2R0C500NT | 7,800 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.0pF/50V, ±0.25pF, COG(NPO) | 50V | 2.0pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
| 0328-0079-4 | 0402N1R8B500LT | 9,089 | 0.15 | | PB-Free | | Ceramic Chip Cap 1.8pF/50Vdc, ±0.1pF, NPO | 50V | 1.8pF | ±0.1pF | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 0160-0047-4 | GJM1555C1H1R8CB01D | 341 | 0.44 | | PB-Free | | Chip Monolithic Ceramic Cap 1.8pF/50Vdc, Tolerance ±0.25pF, C0G, High Q for General Purpose | 50V | 1.8pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0160-0046-1 | GJM1555C1H1R5CB01D | 360 | 0.44 | | PB-Free | | Chip Monolithic Ceramic Cap 1.5pF/50Vdc, Tolerance ±0.25pF, C0G, High Q for General Purpose | 50V | 1.5pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | MURATA | Surface Mount | - |
| 0328-0078-1 | 0402N1R5B500LT | 9,770 | 0.13 | | PB-Free | | Ceramic Chip Cap 1.5pF/50Vdc, ±0.1pF, NPO | 50V | 1.5pF | ±0.1pF | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
| 1649-0002-3 | 0402CG1R5C500NT | 8,900 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1.5pF/50V, ±0.25pF, COG(NPO) | 50V | 1.5pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | FH(GUANGDONG FENGHUA ADVANCED TECH) | Surface Mount | - |
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