| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0270-7 | CL10C3R9BB8NNNC | 28,168 | 0.21 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0328-0204-2 | 0603N300J500CT | 37,400 | 0.24 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 30pF/50Vdc, ±5%, NP0 (C0G) | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0205-6 | CL21B331KBANNNC | 74,693 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 330pF/50Vdc, ±10% X7R | 50V | 330pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0328-0211-9 | 0603N330J500CT | 20,931 | 0.20 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 33pF/50Vdc, ±5%, NP0 (C0G) | 50V | 33pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | WALSIN | Surface Mount | - |
| 0082-0261-6 | CL10C4R7BB8NNNC | 15,615 | 0.97 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7pF/50Vdc, ±0.1pF COG | 50V | 4.7pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0268-1 | CL05A475MP5NRNC | 3,780 | 0.29 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/10Vdc, ±20%, X5R | 10V | 4.7μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0265-4 | CL10A475KO8NNNC | 81,821 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0228-8 | CL21A475KBQNNNE | 52,723 | 0.78 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/50Vdc, ±10% X5R | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0227-6 | CL21B473KBCNNNC | 12,930 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0257-5 | CL31A476MPHNNNE | 7,466 | 2.04 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47μF/10Vdc, ±20%, X5R | 10V | 47μF | ±20% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0328-0193-3 | 0805B682K500CT | 38,209 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 6.8nF/50Vdc, ±10%, X7R | 50V | 6.8nF | ±10% | X7R | 125°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0082-0263-1 | CL10C750JB8NNNC | 143,580 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 75pF/50Vdc, ±5%, COG | 50V | 75pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0328-0081-4 | 0402N4R7C500LT | 7,226 | 0.10 | | PB-Free | | Multilayer Ceramic Chip Cap,4.7pF/50Vdc,±0.25pF NP0 (C0G) | 50V | 4.7pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | WALSIN | Surface Mount | - |
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