Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0092-0411-6 | 04025C103KAT2A | 9,550 | 0.19 | PB-Free | RoHS | Ceramic Chip Cap 10nF/50Vdc ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - | ||
0092-0412-8 | 04025C104KAT2A | 9,000 | 0.41 | PB-Free | RoHS | Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - | ||
0092-0413-1 | 04025C221KAT2A | 9,850 | 0.22 | PB-Free | RoHS | Ceramic Chip Cap 220pF/50Vdc ±10%, X7R | 50V | 220pF | ±10% | X7R | 125°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - | ||
0092-0414-2 | 04025C471KAT2A | 9,900 | 0.20 | PB-Free | RoHS | Ceramic Chip Cap 470pF/50Vdc ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0402 (1005) | KYOCERA AVX | Surface Mount | - | ||
0082-0270-7 | CL10C3R9BB8NNNC | 28,168 | 0.21 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0271-9 | CL10C2R7CB8NNNC | 11,101 | 0.23 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc,±0.25pF COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0283-6 | CL10B223KB8NNNC | 3,074 | 0.53 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22nF/50Vdc, ±10%, X7R | 50V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0285-1 | CL05B103KB5NNNC | 9,703 | 0.15 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0248-4 | CL10C151JB8NNNC | 14,630 | 0.75 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0256-3 | CL10C3R3BB8NNNC | 14,534 | 0.23 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0246-1 | CL10B222KB8NFNC | 1,737 | 0.74 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2nF/50Vdc, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0237-9 | CL05B104KO5NNNC | 21,076 | 0.10 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0165-2 | CL21B105KBFNNNE | 77,892 | 0.54 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |