Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0082-0210-9 | CL31C300JBCNNNC | 313 | 1.16 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - | ||
0082-0213-5 | CL21A106KAYNNNE | 354,549 | 0.56 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0214-7 | CL32A226KAJNNNE | 50,735 | 6.14 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/25Vdc, ±10% X5R | 25V | 22μF | ±10% | X5R | 85°C | 1210 (3225) | SAMSUNG | Surface Mount | - | ||
0082-0215-9 | CL31B104KBCNNNC | 67,723 | 0.58 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/50Vdc, ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - | ||
0082-0223-8 | CL10B103KB8NNNC | 119,814 | 0.13 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10% X7R | 50V | 10nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0224-1 | CL10B104KB8NNNC | 717,410 | 0.12 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.1μF/50Vdc ±10%, X7R | 50V | 0.1μF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0226-4 | CL21B334KBFNNNE | 6,093 | 0.60 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.33μF/50Vdc, ±10% X7R | 50V | 0.33μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0227-6 | CL21B473KBCNNNC | 13,188 | 0.54 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0228-8 | CL21A475KBQNNNE | 54,416 | 0.77 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/50Vdc, ±10% X5R | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0237-9 | CL05B104KO5NNNC | 25,973 | 0.09 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.22 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0243-4 | CL10A106MO8NQNC | 28,932 | 0.69 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0244-6 | CL05A474KA5NNNC | 8,354 | 1.02 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.47μF/25Vdc, ±10%, X5R | 25V | 0.47μF | ±10% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0246-1 | CL10B222KB8NFNC | 1,887 | 0.70 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2nF/50Vdc, ±10%, X7R | 50V | 2.2nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0247-2 | CL10A226MQ8NRNC | 696 | 0.57 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |