Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
1721-0020-1 | 08055A180JAT2A | 35,071 | 0.36 | PB-Free | RoHS | Ceramic Chip Cap 18pF/50Vdc ±5%, C0G(NP0) | 50V | 18pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - | ||
0160-0586-6 | GRM31A5C3A151JW01D-CT-20 | 2,930 | 2.95 | PB-Free | RoHS | Chip Monolithic Ceramic Cap 150pF/1000VDC,±5% C0G(NPO),General Purpose | 1000V | 150pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | MURATA | Surface Mount | - | ||
0082-0168-1 | CL10C100JB8NNNC | 28,003 | 0.22 | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±5% COG | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0154-5 | CL10C300JB8NNNC | 0 | 0.10 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0155-8 | CL10C200JB8NNNC | 19,242 | 0.33 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5%, COG | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0158-7 | CL21C100DBANNNC | 29,344 | 0.28 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | ||
0082-0198-5 | CL10C100DB8NNNC | 7,310 | 1.44 | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±0.5pF COG | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0210-9 | CL31C300JBCNNNC | 8,163 | 1.17 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5%, COG | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | SAMSUNG | Surface Mount | - | ||
0082-0200-6 | CL10C220JB8NNNC | 64,375 | 0.32 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22pF/50Vdc, ±5% COG | 50V | 22pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.23 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0248-4 | CL10C151JB8NNNC | 14,630 | 0.75 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0256-3 | CL10C3R3BB8NNNC | 14,534 | 0.23 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0261-6 | CL10C4R7BB8NNNC | 15,615 | 0.97 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7pF/50Vdc, ±0.1pF COG | 50V | 4.7pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0262-8 | CL10C120JB8NNNC | 6,310 | 0.26 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 12pF/50Vdc, ±5%, COG | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0263-1 | CL10C750JB8NNNC | 143,580 | 0.30 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 75pF/50Vdc, ±5%, COG | 50V | 75pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |