| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0243-4 | CL10A106MO8NQNC | 24,631 | 0.71 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0208-2 | CL21B106KOQNNNE | 200,985 | 1.00 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc,±10% X7R | 16V | 10μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0213-5 | CL21A106KAYNNNE | 340,633 | 0.58 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc, ±10% X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0187-1 | CL31A106KBHNNNE | 108,099 | 1.13 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/50Vdc, ±10%, X5R | 50V | 10μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0266-6 | CL05A106MQ5NUNC | 9,161 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/6.3Vdc, ±20%, X5R | 6.3V | 10μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0092-0466-1 | 1206YC106MAT2A | 0 | 5.83 | | PB-Free | RoHS | Ceramic Chip Cap 10μF/16Vdc ±20%, X7R | 16V | 10μF | ±20% | X7R | 125°C | 1206 (3216) | KYOCERA AVX | Surface Mount | - |
| 0092-0461-1 | 08056D106KAT2A | 0 | 2.05 | | PB-Free | RoHS | Ceramic Chip Cap 10μF/6.3Vdc ±10%, X5R | 6.3V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
| 0328-0150-4 | 0805X106K250CT | 47,863 | 1.38 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25Vdc,±10%,X5R | 25V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0328-0108-8 | 0805X106K6R3CT | 15,767 | 1.14 | | PB-Free | RoHS | Chip Cap 10μF/ 6.3Vdc, ±10%, X5R | 6.3V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | WALSIN | Surface Mount | - |
| 0328-0072-3 | 1210X106K160CT | 13,739 | 3.03 | | PB-Free | RoHS | Chip Cap 10μF/16Vdc, ±10%, X5R | 16V | 10μF | ±10% | X5R | 85°C | 1210 (3225) | WALSIN | Surface Mount | - |
| 0169-0125-8 | C2012JB1V106K085AC | 0 | 6.11 | | | RoHS | Multilayer Ceramic Chip Cap 10μF/35Vdc ±10%, JB, Temperature Stable and General Purpose | 35V | 10μF | ±10% | JB | 85°C | 0805 (2012) | TDK | Surface Mount | - |
| 0169-0169-4 | C3216X7R1C106KT000N | 12,770 | 1.94 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/16Vdc ±10%, X7R, Temperature Stable and General Purpose | 16V | 10μF | ±10% | X7R | 125°C | 1206 (3216) | TDK | Surface Mount | - |
| 0169-0118-3 | C3216X7R1V106M160AC | 0 | 15.17 | | | RoHS | Multilayer Ceramic Chip Cap 10 μF/35Vdc ±20%, X7R, Temperature Stable and General Purpose | 35V | 10μF | ±20% | X7R | 125°C | 1206 (3216) | TDK | Surface Mount | - |
| 0328-0060-3 | 1210X226M100CT | 620 | 4.82 | | PB-Free | | Chip Cap 22μF/10Vdc, ±20%, X5R | 10V | 22μF | ±20% | X5R | 85°C | 1210 (3225) | WALSIN | Surface Mount | - |
| 0082-0247-2 | CL10A226MQ8NRNC | 696 | 0.59 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
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