| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0227-6 | CL21B473KBCNNNC | 13,188 | 0.54 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0237-9 | CL05B104KO5NNNC | 25,973 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0242-2 | CL10C470JB8NNNC | 26,292 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47pF/50Vdc, ±5%, COG | 50V | 47pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0248-4 | CL10C151JB8NNNC | 14,630 | 0.71 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% C0G | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0256-3 | CL10C3R3BB8NNNC | 14,634 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0261-6 | CL10C4R7BB8NNNC | 15,645 | 0.92 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7pF/50Vdc, ±0.1pF COG | 50V | 4.7pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0262-8 | CL10C120JB8NNNC | 6,332 | 0.25 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 12pF/50Vdc, ±5%, COG | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0263-1 | CL10C750JB8NNNC | 143,580 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 75pF/50Vdc, ±5%, COG | 50V | 75pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0270-7 | CL10C3R9BB8NNNC | 28,268 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0271-9 | CL10C2R7CB8NNNC | 11,101 | 0.22 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc,±0.25pF COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.53 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0283-6 | CL10B223KB8NNNC | 3,094 | 0.50 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22nF/50Vdc, ±10%, X7R | 50V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0285-1 | CL05B103KB5NNNC | 9,703 | 0.14 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0092-0107-2 | 06035C681KAT2A | 1,206 | 0.76 | | PB-Free | RoHS | Ceramic Chip Cap 680pF/50Vdc ±10%, X7R | 50V | 680pF | ±10% | X7R | 125°C | 0603 (1608) | KYOCERA AVX | Surface Mount | - |
| 0092-0109-8 | 08055C473KAT2A | 705 | 1.14 | | PB-Free | RoHS | Ceramic Chip Cap 47nF/50Vdc ±10%, X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | KYOCERA AVX | Surface Mount | - |
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