Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
0169-0124-5 | CGA4J3X5R1H475K125AB | 2,285 | 4.37 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 4.7μF/50Vdc, ±10%, X5R, Automotive Grade | 50V | 4.7μF | ±10% | X5R | 85°C | 0805 (2012) | TDK | Surface Mount | - | ||
0169-0184-1 | CGA5F4C0G2J472J085AA | 12 | 18.20 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 4.7nF/630Vdc ±5%, C0G, Automotive Grade, AEC-Q200 Compliant | 630V | 4.7nF | ±5% | C0G (NP0) | 125°C | 1206 (3216) | TDK | Surface Mount | - | ||
0169-0123-2 | CGJ4C2C0G1H561J060AA | 1,725 | 1.92 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 560pF/50Vdc ±5%, C0G | 50V | 560pF | ±5% | C0G (NP0) | 125°C | 0805 (2012) | TDK | Surface Mount | - | ||
0082-0266-6 | CL05A106MQ5NUNC | 9,161 | 0.28 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/6.3Vdc, ±20%, X5R | 6.3V | 10μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0264-2 | CL05A225MQ5NSNC | 5,473 | 0.19 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/6.3Vdc, ±20%, X5R | 6.3V | 2.2μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0244-6 | CL05A474KA5NNNC | 8,354 | 1.08 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.47μF/25Vdc, ±10%, X5R | 25V | 0.47μF | ±10% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0268-1 | CL05A475MP5NRNC | 3,780 | 0.29 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/10Vdc, ±20%, X5R | 10V | 4.7μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0285-1 | CL05B103KB5NNNC | 9,703 | 0.15 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0237-9 | CL05B104KO5NNNC | 21,076 | 0.10 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 0.1μF/16Vdc, ±10%, X7R | 16V | 0.1μF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - | ||
0082-0178-5 | CL10A105KB8NNNC | 298,867 | 0.21 | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%, X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0243-4 | CL10A106MO8NQNC | 24,621 | 0.71 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/16Vdc, ±20%, X5R | 16V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0290-3 | CL10A225KL8NNNC | 3,310 | 1.17 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/35Vdc, ±10%, X5R | 35V | 2.2μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0247-2 | CL10A226MQ8NRNC | 696 | 0.59 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - | ||
0082-0265-4 | CL10A475KO8NNNC | 81,821 | 0.28 | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |