| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0158-0303-9 | T100KCHE041LF | 7,088 | 0.53 |  | PB-Free | RoHS | Ceramic Disc Cap 10pF/50Vdc, ±10%, Class I, Diameter 5mm, Bulk Straight Lead | 50V | 10pF | ±10% | C0G (NP0) | 85°C | RADIAL | AEC | Through Hole | 2.5mm |
 | 0158-0309-1 | R150JCF21L | 18,339 | 0.53 | | PB-Free | RoHS | Multilayer Ceramic Cap 15pF/50Vdc ±5%, NPO Radial, Straight Lead, Lead Spacing 2.54mm. | 50V | 15pF | ±5% | C0G (NP0) | 85°C | RADIAL | AEC | Through Hole | 2.54mm |
 | 0082-0283-6 | CL10B223KB8NNNC | 3,074 | 0.53 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22nF/50Vdc, ±10%, X7R | 50V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0165-2 | CL21B105KBFNNNE | 77,892 | 0.54 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0227-6 | CL21B473KBCNNNC | 12,930 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47nF/50Vdc, ±10% X7R | 50V | 47nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0158-0297-1 | H103ZZFE051LF | 6,894 | 0.55 | | PB-Free | RoHS | Ceramic Disc Cap 0.01μF/50Vdc,+80%/-20%,Z5V | 50V | 10nF | +80%/-20% | Z5V | 85°C | RADIAL | AEC | Through Hole | 2.5mm |
| 0158-0298-2 | H471KYAE051LF | 5,204 | 0.55 | | PB-Free | | Ceramic Disc Cap 470pF/50Vdc, ±10% | 50V | 470pF | ±10% | Y5E | 85°C | RADIAL | AEC | Through Hole | 2.5mm |
| 0158-0112-0 | H471KYAE051L | 177 | 0.55 | | PB-Free | | Ceramic Disc Cap 470pF/50Vdc, ±10% | 50V | 470pF | ±10% | Y5E | 85°C | RADIAL | AEC | Through Hole | 2.5mm |
 | 0158-0197-7 | H102KYBE042B-T | 1 | 0.55 | | PB-Free | | Ceramic Disc Cap 1nF/50Vdc, ±10% | 50V | 1nF | ±10% | Y5P | 85°C | RADIAL | AEC | Through Hole | 5mm |
| 0158-0241-4 | T200JCHE051L | 6 | 0.55 | | PB-Free | | Ceramic Disc Cap 20pF/50Vdc, ±5% | 50V | 20pF | ±5% | C0G (NP0) | 85°C | RADIAL | AEC | Through Hole | 2.5mm |
| 0158-0276-2 | H102KYBE051LF | 20,390 | 0.55 | | | RoHS | Ceramic Disc Cap 1nF/50Vdc,±10%,Y5P | 50V | 1nF | ±10% | Y5P | 85°C | RADIAL | AEC | Through Hole | 2.5mm |
| 0158-0293-2 | T221KSLE052LF | 11,948 | 0.55 | | PB-Free | RoHS | Ceramic Disc Cap 220pF/50Vdc, ±10%,SL | 50V | 220pF | ±10% | SL | 85°C | RADIAL | AEC | Through Hole | 5mm |
| 0158-0013-8 | H103ZZFE051L | 3 | 0.55 | | PB-Free | RoHS | Ceramic Disc Cap 0.01μF/50Vdc,+80%/-20%, Z5V | 50V | 10nF | +80%/-20% | Z5V | 85°C | RADIAL | AEC | Through Hole | 2.5mm |
 | 0033-0059-2 | UMK105BJ471KV-F | 2,000 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50V, ±10%, X5R/B (EIA/JIS), High Dielectric Type | 50V | 470pF | ±10% | X5R | 85°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
| 0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
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