| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0265-4 | CL10A475KO8NNNC | 81,821 | 0.28 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0266-6 | CL05A106MQ5NUNC | 9,161 | 0.28 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/6.3Vdc, ±20%, X5R | 6.3V | 10μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0268-1 | CL05A475MP5NRNC | 3,780 | 0.29 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/10Vdc, ±20%, X5R | 10V | 4.7μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0270-7 | CL10C3R9BB8NNNC | 28,168 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0271-9 | CL10C2R7CB8NNNC | 11,101 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc,±0.25pF COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0282-4 | CL05C8R2CB5NNNC | 9,647 | 0.56 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 8.2pF/50Vdc, ±0.25pF, C0G | 50V | 8.2pF | ±0.25pF | C0G (NP0) | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0283-6 | CL10B223KB8NNNC | 3,074 | 0.53 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22nF/50Vdc, ±10%, X7R | 50V | 22nF | ±10% | X7R | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0285-1 | CL05B103KB5NNNC | 9,703 | 0.15 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10nF/50Vdc, ±10%, X7R | 50V | 10nF | ±10% | X7R | 125°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0290-3 | CL10A225KL8NNNC | 3,310 | 1.17 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/35Vdc, ±10%, X5R | 35V | 2.2μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
 | 0575-0003-5 | U0603C5R6CNT | 7,236 | 0.69 | | | | Chip Cap 5.6pF/50Vdc, ±0.25PF, NPO General Purpose | 50V | 5.6pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | PAN OVERSEAS | Surface Mount | - |
| 0160-0381-8 | GRM31A7U2J331JW31D | 2,446 | 1.40 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 330pF/630VDC,±5% U2J,General Purpose | 630V | 330pF | ±5% | U2J | 125°C | 1206 (3216) | MURATA | Surface Mount | - |
| 0160-0382-1 | GRM31A7U2J471JW31D | 2,585 | 2.05 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 470pF/630VDC,±5% U2J,General Purpose | 630V | 470pF | ±5% | U2J | 125°C | 1206 (3216) | MURATA | Surface Mount | - |
| 0160-0383-2 | GRM31A7U2J681JW31D | 11,141 | 2.18 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 680pF/630VDC,±5% U2J,General Purpose | 630V | 680pF | ±5% | U2J | 125°C | 1206 (3216) | MURATA | Surface Mount | - |
| 0160-0384-4 | GRM31A7U2J102JW31D | 1,163 | 2.31 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 1nF/630VDC,±5% U2J,General Purpose | 630V | 1nF | ±5% | U2J | 125°C | 1206 (3216) | MURATA | Surface Mount | - |
| 0160-0385-6 | GRM31A7U3A101JW31D | 3,202 | 2.79 | | PB-Free | RoHS | Chip Monolithic Ceramic Cap 100pF/1000VDC,±5% U2J,General Purpose | 1000V | 100pF | ±5% | U2J | 125°C | 1206 (3216) | MURATA | Surface Mount | - |
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