| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0033-0010-9 | UVK105CH2R2JW-F | 381 | 2.40 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2pF/50V ±5%, C0H, For High Frequency Applications | 50V | 2.2pF | ±5% | CH | 125°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
 | 0033-0021-6 | LMK212BJ226MG-T | 23,044 | 0.83 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10V, ±20%, X5R, High Dielectric Type | 10V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |
| 0033-0046-3 | UMK107B7474KA-TR | 0 | 2.72 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/50V, ±10%, X7R, High Dielectric Type | 50V | 0.47μF | ±10% | X7R | 125°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |
| 0033-0059-2 | UMK105BJ471KV-F | 2,000 | 0.55 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50V, ±10%, X5R/B (EIA/JIS), High Dielectric Type | 50V | 470pF | ±10% | X5R | 85°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
| 0033-0063-3 | LMK212BJ106KG-T | 36,249 | 0.63 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/10V, ±10%, X5R, High Dielectric Type | 10V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |
| 0033-0070-1 | EMK107B7105KA-T | 100 | 0.24 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/16V, ±10%, X7R, High Dielectric Type | 16V | 1μF | ±10% | X7R | 125°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |
 | 0834-0002-3 | TS170R1H473MSAFA0R | 16,839 | 1.19 | | PB-Free | RoHS | Multilayer (Mono) Ceramic Capacitor, 47nF/50V, ±20%, Y5V, Radial, Pitch 2.54mm. | 50V | 47nF | ±20% | Y5V | 85°C | RADIAL | SUNTAN | Through Hole | 2.54mm |
| 0834-0003-5 | TS170R1H333ZSBFA0R | 76,523 | 0.96 | | PB-Free | RoHS | Multilayer (Mono) Ceramic Capacitor, 33nF/50V, +80%/-20%, Y5V, Radial, Pitch 2.54mm. | 50V | 33nF | +80%/-20% | Y5V | 85°C | RADIAL | SUNTAN | Through Hole | 2.54mm |
 | 0834-0004-7 | TS18000J226M4TX00R | 9,735 | 3.27 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/6.3Vdc, ±20%, X5R | 6.3V | 22μF | ±20% | X5R | 85°C | 0402 (1005) | SUNTAN | Surface Mount | - |
| 0834-0005-9 | TS18001V106K8TX00R | 19,307 | 0.66 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/35Vdc, ±10%, X5R | 35V | 10μF | ±10% | X5R | 85°C | 0805 (2012) | SUNTAN | Surface Mount | - |
| 0834-0006-1 | TS18001V475K6TX00R | 63,710 | 0.95 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 4.7μF/35Vdc, ±10%, X5R | 35V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SUNTAN | Surface Mount | - |
| 0834-0007-3 | TS18001H475K1TB00R | 33,970 | 2.52 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 4.7μF/50Vdc, ±10%, X7R | 50V | 4.7μF | ±10% | X7R | 125°C | 1210 (3225) | SUNTAN | Surface Mount | - |
| 0834-0008-5 | TS18001E105K6TB00R | 120,000 | 0.25 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/25Vdc, ±10%, X7R | 25V | 1μF | ±10% | X7R | 125°C | 0603 (1608) | SUNTAN | Surface Mount | - |
| 0082-0149-6 | CL21B471KBANNNC | 13,097 | 0.39 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, X7R | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0150-3 | CL21B152KBANNNC | 11,053 | 0.18 | | PB-Free | | Multilayer Ceramic Chip Cap, 1.5nF/50Vdc, ±10%, X7R | 50V | 1.5nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
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