| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
| | | | | | | | | | | | | | | | | |
 | 0082-0248-4 | CL10C151JB8NNNC | 13,740 | 0.75 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 150pF/50Vdc, ±5% COG | 50V | 150pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0256-3 | CL10C3R3BB8NNNC | 16,606 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.3pF/50Vdc, ±0.1pF COG | 50V | 3.3pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0257-5 | CL31A476MPHNNNE | 12,206 | 1.54 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 47μF/10Vdc, ±20%, X5R | 10V | 47μF | ±20% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0260-4 | CL31A226KAHNNNE | 4,955 | 1.62 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±10%, X5R | 25V | 22μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0261-6 | CL10C4R7BB8NNNC | 16,390 | 0.97 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7pF/50Vdc, ±0.1pF COG | 50V | 4.7pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0262-8 | CL10C120JB8NNNC | 1,652 | 0.26 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 12pF/50Vdc, ±5%, COG | 50V | 12pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0263-1 | CL10C750JB8NNNC | 142,230 | 0.30 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 75pF/50Vdc, ±5%, COG | 50V | 75pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0264-2 | CL05A225MQ5NSNC | 7,801 | 0.19 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.2μF/6.3Vdc, ±20%, X5R | 6.3V | 2.2μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0265-4 | CL10A475KO8NNNC | 433,643 | 0.35 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/16Vdc, ±10%, X5R | 16V | 4.7μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0266-6 | CL05A106MQ5NUNC | 26,700 | 0.37 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 10μF/6.3Vdc, ±20%, X5R | 6.3V | 10μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0267-8 | CL10A106MA8NRNC | 1,555 | 0.72 | | PB-Free | RoHS | Multilayer Ceramic Chip Capacitor, 10μF/25Vdc, ±20%, X5R | 25V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0268-1 | CL05A475MP5NRNC | 1,215 | 0.29 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 4.7μF/10Vdc, ±20%, X5R | 10V | 4.7μF | ±20% | X5R | 85°C | 0402 (1005) | SAMSUNG | Surface Mount | - |
| 0082-0270-7 | CL10C3R9BB8NNNC | 11,903 | 0.21 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 3.9pF/50Vdc, ±0.1pF COG | 50V | 3.9pF | ±0.1pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0271-9 | CL10C2R7CB8NNNC | 14,325 | 0.23 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 2.7pF/50Vdc, ±0.25pF, COG | 50V | 2.7pF | ±0.25pF | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0276-9 | CL03A105MP3NSNC | 9,700 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/10Vdc, ±20%, X5R | 10V | 1μF | ±20% | X5R | 85°C | 0201 (0603) | SAMSUNG | Surface Mount | - |
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