| Picture | ES Part No. | Part No | Stock | Price | Datasheet | Pb Free | RoHS | Description | Voltage-Rated | Capacitance | Capacitance Tolerance | Temperature Characteristic/Dielectric | Maximum Temperature | Package / Case | Vendor | Mounting Type | Lead Spacing |
  | | | | | | | | | | | | | | ||||
 | 0033-0010-9 | UVK105CH2R2JW-F | 1,855 | 2.20 |  | PB-Free | RoHS | Multilayer Ceramic Chip Cap 2.2pF/50V ±5%, C0H, For High Frequency Applications | 50V | 2.2pF | ±5% | C0H | 125°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
 | 0033-0021-6 | LMK212BJ226MG-T | 53,956 | 1.91 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10V, ±20%, X5R, High Dielectric Type | 10V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | TAIYO YUDEN | Surface Mount | - |
| 0033-0046-3 | UMK107B7474KA-TR | 121 | 2.50 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 0.47μF/50V, ±10%, X7R, High Dielectric Type | 50V | 0.47μF | ±10% | X7R | 125°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |
| 0033-0058-1 | TMK107BBJ106MA-T | 0 | 2.08 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10μF/25V, ±20%, X5R, High Dielectric Type | 25V | 10μF | ±20% | X5R | 85°C | 0603 (1608) | TAIYO YUDEN | Surface Mount | - |
| 0033-0059-2 | UMK105BJ471KV-F | 2,470 | 0.51 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 470pF/50V, ±10%, X5R/B (EIA/JIS), High Dielectric Type | 50V | 470pF | ±10% | X5R/B | 85°C | 0402 (1005) | TAIYO YUDEN | Surface Mount | - |
 | 0082-0149-6 | CL21B471KBANNNC | 30,603 | 0.40 | | PB-Free | Multilayer Ceramic Chip Cap 470pF/50Vdc, ±10%, | 50V | 470pF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | |
| 0082-0150-3 | CL21B152KBANNNC | 7,269 | 0.36 | | PB-Free | Multilayer Ceramic Chip Cap, 1.5nF/50Vdc, ±10%, X7R | 50V | 1.5nF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - | |
| 0082-0154-5 | CL10C300JB8NNNC | 26 | 0.09 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 30pF/50Vdc, ±5% C0G | 50V | 30pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0155-8 | CL10C200JB8NNNC | 65,104 | 0.37 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 20pF/50Vdc, ±5% | 50V | 20pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0158-7 | CL21C100DBANNNC | 25,365 | 0.65 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF C0G( NPO ) | 50V | 10pF | ±0.5pF | C0G (NP0) | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0163-6 | CL31A226KPHNNNE | 46,957 | 2.37 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 22μF/10Vdc,±10%, X5R | 10V | 22μF | ±10% | X5R | 85°C | 1206 (3216) | SAMSUNG | Surface Mount | - |
| 0082-0165-2 | CL21B105KBFNNNE | 11,028 | 0.77 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 1μF/50Vdc, ±10%, X7R | 50V | 1μF | ±10% | X7R | 125°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0168-1 | CL10C100JB8NNNC | 40,795 | 1.10 | | PB-Free | RoHS | Multilayer Ceramic Capacitor 10pF/50Vdc ±5% NPO(C0G) | 50V | 10pF | ±5% | C0G (NP0) | 125°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
| 0082-0176-9 | CL21A226MAQNNNE | 2,995 | 2.01 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap, 22μF/25Vdc, ±20%, X5R | 25V | 22μF | ±20% | X5R | 85°C | 0805 (2012) | SAMSUNG | Surface Mount | - |
| 0082-0178-5 | CL10A105KB8NNNC | 30 | 0.38 | | PB-Free | RoHS | Multilayer Ceramic Chip Cap 1μF/50Vdc,±10%,X5R | 50V | 1μF | ±10% | X5R | 85°C | 0603 (1608) | SAMSUNG | Surface Mount | - |
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