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Ceramic Capacitors
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0033-0010-9UVK105CH2R2JW-F 1,6052.20PB-FreeRoHSMultilayer Ceramic Chip Cap 2.2pF/50V ±5%,C0H
for High Frequency Application
50V 2.2pF±5% C0H - 0402 (1005)Surface Mount TAIYO YUDENUVK High Frequency
0033-0021-6LMK212BJ226MG-T 33,1531.87PB-FreeRoHSCeramic Chip Cap 22uF/10Vdc ±20%,X5R
10V 22μF±20% X5R - 0805 (2012)Surface Mount TAIYO YUDENLMK General purpose
0033-0030-8TMK325BJ225MHHT 324.42PB-FreeRoHSMultilayer Ceramic Chip Cap 2.2uF/25VDC ±20%,X5R
for Automative/Industrial Application
25V 2.2μF±20% X5R - 1210 (3225)Surface Mount TAIYO YUDENTMK Automotive/Industrial
0082-0149-6CL21B471KBANNNC 60,5480.40PB-FreeMultilayer Ceramic Chip Cap 470pF/50Vdc, ±10%,
50V 470pF±10% X7R - 0805 (2012)Surface Mount SAMSUNGCL Low ESR
0082-0154-5CL10C300JB8NNNC 2,5000.09PB-FreeRoHSMultilayer Ceramic Chip Cap 30pF/50Vdc, ±5% C0G
50V 30pF±5% C0G (NPO) - 0603 (1608) Surface Mount SAMSUNGCL Low ESR
0082-0155-8CL10C200JB8NNNC 80,1690.37PB-FreeRoHSMultilayer Ceramic Chip Cap 20pF/50Vdc, ±5%
50V 20pF±5% C0G (NPO) - 0603 (1608)Surface Mount SAMSUNGCL Low ESR
0082-0158-7CL21C100DBANNNC 26,5500.64PB-FreeRoHSMultilayer Ceramic Chip Cap 10pF/50Vdc, ±0.5pF
C0G( NPO )
50V 10pF±0.5pF C0G (NPO) - 0805 (2012)Surface Mount SAMSUNGCL Low ESR
0082-0163-6CL31A226KPHNNNE 34,0762.74PB-FreeRoHSMultilayer Ceramic Chip Cap 22uF/10Vdc,±10%, X5R
10V 22μF±10% X5R - 1206 (3216)Surface Mount SAMSUNGCL Low ESR
0082-0168-1CL10C100JB8NNNC 48,0001.10PB-FreeRoHSMultilayer Ceramic Capacitor 10pF/50Vdc ±5%
NPO(C0G)
50V 10pF±5% C0G (NPO) - 0603 (1608)Surface Mount SAMSUNGCL Low ESR
0082-0178-5CL10A105KB8NNNC 20,1080.43PB-FreeRoHSMultilayer Ceramic Chip Cap 1uF/50Vdc,±10%,X5R
50V 1μF±10% X5R - 0603 (1608)Surface Mount SAMSUNGCL Low ESR
0082-0181-8CL21A225KOFNNNE 9711.34PB-FreeRoHSMultilayer Ceramic Chip Cap 2.2uF/16Vdc ±10%,X5R
16V 2.2μF±10% X5R - 0805 (2012)Surface Mount SAMSUNGCL General Purpose
0082-0190-9CL21B471KBANNNC-CT 2650.31PB-FreeRoHSMultilayer Ceramic Chip Cap 470pF/50Vdc, ±10%
50V 470pF±10% X7R - 0805 (2012)Surface Mount SAMSUNGCL Low ESR
0082-0192-3CL21B104KBCNNNC 20,0010.34PB-FreeRoHSMultilayer Ceramic Chip Cap 0.1uF/50Vdc, ±10%
X7R
50V 0.1μF±10% X7R - 0805 (2012)Surface Mount SAMSUNGCL Low ESR
0082-0193-5CL21B104KBCNNNC-CT 70.35PB-FreeRoHSMultilayer Ceramic Chip Cap 0.1uF/50Vdc, ±10%
X7R
50V 0.1μF±10% X7R - 0805 (2012)Surface Mount SAMSUNGCL Low ESR
0082-0197-3CL10B104KB8NFNC 416,3460.16PB-FreeRoHSMultilayer Ceramic Chip Cap 0.1uF/50Vdc ±10%,X7R
50V 0.1μF±10% X7R - 0603 (1608)Surface Mount SAMSUNGCL Low ESR